Title:
ELECTROCONDUCTIVE LAMINATE AND ELECTRONIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2019/093207
Kind Code:
A1
Abstract:
Provided are: an electroconductive laminate in which adhesion performance and barrier function of preventing diffusion of copper, in an electrode or a wire, etc., are improved; a method for manufacturing the electroconductive laminate; and an electronic element. An electroconductive laminate provided with a laminated structure in which a first object, and an electroconductive body comprising copper or an alloy having copper as the main component, are laminated with a tungsten silicide film interposed therebetween, the silicon/tungsten compositional ratio of the tungsten silicide film being greater than 4 and equal to or smaller than 12. Diffusion of copper into the first object is thereby prevented. A high-performance electronic element is realized due to a structure in which the first object is a metal body, a semiconductor, and/or an insulator.
Inventors:
OKADA NAOYA (JP)
UCHIDA NORIYUKI (JP)
OGAWA SHINICHI (JP)
KANAYAMA TOSHIHIKO (JP)
UCHIDA NORIYUKI (JP)
OGAWA SHINICHI (JP)
KANAYAMA TOSHIHIKO (JP)
Application Number:
PCT/JP2018/040556
Publication Date:
May 16, 2019
Filing Date:
October 31, 2018
Export Citation:
Assignee:
AIST (JP)
International Classes:
H01L21/3205; C01B33/06; C23C16/42; H01B5/14; H01B13/00; H01L21/28; H01L21/336; H01L21/768; H01L23/532; H01L29/78
Domestic Patent References:
| WO2013133060A1 | 2013-09-12 |
Foreign References:
| JP2000003884A | 2000-01-07 | |||
| JP2016211038A | 2016-12-15 | |||
| JP2009246379A | 2009-10-22 | |||
| JP2000040675A | 2000-02-08 |
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