ELECTROCONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

Title:

ELECTROCONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2020/255874

Kind Code:

A1

Abstract:

Provided is an electroconductive material with which it is possible to continuously perform an arrangement step during printing and to efficiently arrange solder on an electrode.　The electroconductive material according to the present invention includes a thermosetting component, a plurality of solder particles, and flux, the average particle diameter of the solder particles being less than 10 μm, and the acid value of the solder particles being 0.3-3 mg KOH/g inclusive.

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Inventors:

YAMANAKA YUTA (JP)
TSUJII MIKA (JP)
SADANAGA SHUUJIROU (JP)

Application Number:

PCT/JP2020/023201

Publication Date:

December 24, 2020

Filing Date:

June 12, 2020

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

B23K1/00; B23K35/26; C22C13/00; H01B1/22; H01B5/16; H01R11/01; H05K1/14; H05K3/34

Foreign References:

JP2018006083A	2018-01-11
JP2018046004A	2018-03-22

Attorney, Agent or Firm:

MIYAZAKI & METSUGI (JP)

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