Title:
ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/033932
Kind Code:
A1
Abstract:
To provide an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and improve conduction reliability. In the electroconductive material according to the present invention, the outer surface portion of an electroconductive part includes a thermosetting component, a phosphoric acid compound, and a plurality of electroconductive particles having solder, the viscosity of the electroconductive material at 50°C being 10-100 Pa•s.
Inventors:
ITOU MASAHIRO (JP)
ISHIZAWA HIDEAKI (JP)
KUBOTA TAKASHI (JP)
SADANAGA SHUUJIROU (JP)
ISHIZAWA HIDEAKI (JP)
KUBOTA TAKASHI (JP)
SADANAGA SHUUJIROU (JP)
Application Number:
PCT/JP2016/074529
Publication Date:
March 02, 2017
Filing Date:
August 23, 2016
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; C09J9/02; C09J163/00; H01B1/00; H01B5/16; H01L21/60; H05K1/14; H05K3/32; H05K3/34
Foreign References:
| JP5746797B1 | 2015-07-08 | |||
| JP2014132567A | 2014-07-17 | |||
| JP2012230896A | 2012-11-22 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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