Title:
ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/033933
Kind Code:
A1
Abstract:
Provided is an electroconductive material in which solder can be selectively disposed in the electroconductive particles on an electrode without an inorganic filler excessively inhibiting the movement of the solder, electroconductivity can be made more reliable, and the dimensions of the cured electroconductive material can be made more stable. The electroconductive material according to the present invention includes, in an outer surface portion of an electroconductive part: a plurality of electroconductive particles that have solder; a heat-curable component; and an inorganic filler having a degree of hydrophobization of 40 or more, the viscosity of the electroconductive material at 50°C being 10-200 Pa·s.
Inventors:
SADANAGA SHUUJIROU (JP)
NAGATA MAI (JP)
ITOU MASAHIRO (JP)
KUBOTA TAKASHI (JP)
ISHIZAWA HIDEAKI (JP)
NATSUI HIROSHI (JP)
NAGATA MAI (JP)
ITOU MASAHIRO (JP)
KUBOTA TAKASHI (JP)
ISHIZAWA HIDEAKI (JP)
NATSUI HIROSHI (JP)
Application Number:
PCT/JP2016/074530
Publication Date:
March 02, 2017
Filing Date:
August 23, 2016
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; C09J9/02; C09J11/04; C09J201/00; H01B1/00; H01B5/16; H01R11/01
Domestic Patent References:
| WO2013125517A1 | 2013-08-29 |
Foreign References:
| JP2014056816A | 2014-03-27 | |||
| JP2012169263A | 2012-09-06 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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