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Title:
ELECTROCONDUCTIVE MATERIAL, MOLDED ARTICLE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/079904
Kind Code:
A1
Abstract:
Provided is an electroconductive material exhibiting excellent resin adhesion even in a harsh environment. An electroconductive material in which a resin is molded on the surface thereof, or the surface of which is sealed by a resin, wherein the surface of the electroconductive material is constituted from a metal, and satisfies conditions (1) and (2). (1): The arithmetic mean surface roughness height Sa is 0.25-0.4 µm. (2): The peak density Spd of peaks is at least 2,500,000 per 1 mm2.

Inventors:
SASAKI YASUNORI (JP)
KAWAMURA TAKAHIRO (JP)
KOBAYASHI YOSHIAKI (JP)
AIBA AKIHIRO (JP)
Application Number:
JP2019/028332
Publication Date:
April 23, 2020
Filing Date:
July 18, 2019
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D5/12; C25D5/16; C25D7/00; H01L23/29; H01L23/31; H01L23/50
Domestic Patent References:
WO2017077903A12017-05-11
WO2018123708A12018-07-05
Foreign References:
JP2017055044A2017-03-16
JP2012116126A2012-06-21
JP2004339584A2004-12-02
JP2013111881A2013-06-10
JPH10265991A1998-10-06
JPH09148508A1997-06-06
JP2010236058A2010-10-21
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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