Title:
ELECTROCONDUCTIVE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/105701
Kind Code:
A1
Abstract:
Provided are electroconductive particles that afford improved connection reliability in a microcircuit. Also provided is an anisotropic conductive material using the particles. Each of the electroconductive particles used has a resin particle (11), a non-electrolytic metal plating layer (12) that covers the surface of the resin particle, and a sputtered non-Au metal layer (13) that forms an outermost layer. Because the hard sputtered metal layer (13) is formed at the outermost layer, the electroconductive particles can be made to bite into the wiring, and high connection reliability can be obtained.
Inventors:
FUKAYA TATSUROU (JP)
YAMAMOTO JUN (JP)
KONISHI MISAO (JP)
SHIMADA RYU (JP)
HOMMURA HAYATO (JP)
KATORI KENJI (JP)
SUDO GO (JP)
YAMAMOTO JUN (JP)
KONISHI MISAO (JP)
SHIMADA RYU (JP)
HOMMURA HAYATO (JP)
KATORI KENJI (JP)
SUDO GO (JP)
Application Number:
PCT/JP2012/052547
Publication Date:
August 09, 2012
Filing Date:
February 03, 2012
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
SONY CORP (JP)
FUKAYA TATSUROU (JP)
YAMAMOTO JUN (JP)
KONISHI MISAO (JP)
SHIMADA RYU (JP)
HOMMURA HAYATO (JP)
KATORI KENJI (JP)
SUDO GO (JP)
SONY CORP (JP)
FUKAYA TATSUROU (JP)
YAMAMOTO JUN (JP)
KONISHI MISAO (JP)
SHIMADA RYU (JP)
HOMMURA HAYATO (JP)
KATORI KENJI (JP)
SUDO GO (JP)
International Classes:
H01B5/00; H01B5/16; H01L21/60; H01R11/01
Foreign References:
| JP2010080124A | 2010-04-08 | |||
| JP2009032397A | 2009-02-12 | |||
| JPH09143441A | 1997-06-03 |
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
Akira Koike (JP)
Download PDF:
Claims:
Previous Patent: METHOD FOR PURIFYING 2,3,3,3-TETRAFLUOROPROPENE
Next Patent: ANTENNA DEVICE AND COMMUNICATION DEVICE
Next Patent: ANTENNA DEVICE AND COMMUNICATION DEVICE