Title:
ELECTROCONDUCTIVE PARTICLES, ELECTROCONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/092188
Kind Code:
A1
Abstract:
Provided are electroconductive particles capable of increasing reliability of electrical conduction and increasing reliability of insulation. The electroconductive particles according to the present invention comprise base particles, and an electroconductive portion positioned on the surface of the base particles. When the electroconductive particles are compressed, at least one configuration among configurations A, B, C, and D is satisfied. Configuration A: The ratio of the voltage change rate when compressed by 10% to the voltage change rate when compressed by 20% is 0.35 or less. Configuration B: The ratio of the voltage change rate when compressed by 10% to the voltage change rate when compressed by 30% is 0.25 or less. Configuration C: The ratio of the voltage change rate when compressed by 10% to the voltage change rate when compressed by 40% is 0.25 or less. Configuration D: the voltage change rate when compressed by 10% to the voltage change rate when compressed by 50% is 0.25 or less.
Inventors:
MATSUURA HIROTO (JP)
WAKIYA TAKESHI (JP)
WAKIYA TAKESHI (JP)
Application Number:
PCT/JP2021/039787
Publication Date:
May 05, 2022
Filing Date:
October 28, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/00; H01B1/22; H01B5/00; H01B5/16; H01R11/01
Domestic Patent References:
| WO2020175691A1 | 2020-09-03 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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