Title:
ELECTROCONDUCTIVE PASTE, METHOD FOR MANUFACTURING AN ELECTROCONDUCTIVE PATTERN, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2014/208445
Kind Code:
A1
Abstract:
The objective of the present invention is to provide an electroconductive paste having extremely high adhesiveness that is capable of forming a very fine electroconductive pattern for expressing electroconductivity in relatively low-temperature curing conditions. The present invention provides an electroconductive paste containing an electroconductive filler (A), a zwitterionic compound (B), and a thermosetting compound (C).
Inventors:
KOBAYASHI YASUHIRO (JP)
Application Number:
PCT/JP2014/066280
Publication Date:
December 31, 2014
Filing Date:
June 19, 2014
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
H01B1/22; C09D4/00; C09D4/02; C09D5/00; C09D5/24; C09D7/12; C09D201/00; G06F3/041; H01B13/00; H05K1/09; H05K3/02
Foreign References:
| JP2013110010A | 2013-06-06 | |||
| JP2013110011A | 2013-06-06 | |||
| JPH0436903A | 1992-02-06 | |||
| JP2010123355A | 2010-06-03 | |||
| JP2005276573A | 2005-10-06 | |||
| JP2009116452A | 2009-05-28 | |||
| JP2011178934A | 2011-09-15 | |||
| JP2004177562A | 2004-06-24 |
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