Title:
ELECTROCONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2014/061765
Kind Code:
A1
Abstract:
Provided is a sintered-type electroconductive paste having excellent electromigration resistance, solder heat resistance, and adhesion to substrates. This electroconductive paste comprises: (A) silver powder; (B) glass frit; (C) an organic binder; and (D) a powder including copper, tin, and manganese. This electroconductive paste preferably comprises 0.1-5.0 parts by mass of said powder (D) per 100 parts by mass of said silver powder (A).
Inventors:
YOSHII YOSHIAKI (JP)
Application Number:
PCT/JP2013/078260
Publication Date:
April 24, 2014
Filing Date:
October 18, 2013
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H01B1/22; C09D5/24; C09D7/12; C09D201/00; H01B1/00; H01B5/14; H05K1/09; H05K3/12
Foreign References:
| JPS55149356A | 1980-11-20 | |||
| JP2007123301A | 2007-05-17 | |||
| JP2006313744A | 2006-11-16 | |||
| JP2006196421A | 2006-07-27 | |||
| JPS63119105A | 1988-05-23 | |||
| JPH04230002A | 1992-08-19 | |||
| JPS55149356A | 1980-11-20 | |||
| JP2003115216A | 2003-04-18 | |||
| JP2006196421A | 2006-07-27 |
Other References:
See also references of EP 2911160A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)
Patent business corporation Tsukuni (JP)
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