Title:
ELECTROCONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2016/121668
Kind Code:
A1
Abstract:
Provided is an electroconductive paste that is particularly suitable as an electroconductive paste for through-hole conduction, and has an excellent shape while maintaining low electrical resistance in a cured coating layer, it being easy to obtain a cured coating layer having high resistance to temperature variation. An electroconductive paste containing an electroconductive filler, a chelate-forming substance, a phenol resin, a modified epoxy resin, and a printability-improving agent. A printed circuit board in which through-holes are made to be conductive using the cured product of the electroconductive paste.
Inventors:
OGAWA TAKAYUKI (JP)
DOI SHOKO (JP)
SAITO HIROSHI (JP)
DOI SHOKO (JP)
SAITO HIROSHI (JP)
Application Number:
PCT/JP2016/051960
Publication Date:
August 04, 2016
Filing Date:
January 25, 2016
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
H01B1/22; C08K3/08; C08K5/3432; C08K5/55; C08K9/02; C08L61/06; C08L63/00; H05K1/09; H05K1/11
Foreign References:
| JPH08273432A | 1996-10-18 | |||
| JP2000219811A | 2000-08-08 | |||
| JPH11222549A | 1999-08-17 | |||
| JP2015028869A | 2015-02-12 |
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
Akio Miyazaki (JP)
Akio Miyazaki (JP)
Download PDF: