Title:
ELECTROCONDUCTIVE PATTERN, SUBSTRATE WITH ELECTROCONDUCTIVE PATTERN, METHOD FOR MANUFACTURING SUBSTRATE WITH ELECTROCONDUCTIVE PATTERN, STRUCTURE HAVING ON-SURFACE ELECTROCONDUCTIVE PATTERN, AND METHOD FOR MANUFACTURING SAID STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2015/115503
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an electroconductive pattern capable of reducing the visibility of electroconductive wiring, reducing the resistance value, improving adhesiveness between a substrate and an electroconductive pattern, minimizing fluctuation in resistance values when the substrate is bent, and furthermore imparting durability such as heat and moisture resistance; a substrate with an electroconductive pattern; a method for manufacturing a substrate with an electroconductive pattern; a structure having an on-surface electroconductive pattern; and a method for manufacturing said structure. A pattern comprising an electroconductive fine wire (2) measuring less than 10 μm in width, characterized in that at least a portion of the fine wire has a multilayered structure, and the multilayered structure has as constituent elements: a first layer (21) measuring less than 500 nm in thickness and containing one or more electroconductive materials selected from electroconductive particles, an electroconductive filler, and an electroconductive wire; and a second layer (22) that is thicker than the first layer (21) and has metal as a principal component.
Inventors:
OHYA HIDENOBU (JP)
NIIZUMA NAOTO (JP)
YAMAUCHI MASAYOSHI (JP)
NIIZUMA NAOTO (JP)
YAMAUCHI MASAYOSHI (JP)
Application Number:
PCT/JP2015/052405
Publication Date:
August 06, 2015
Filing Date:
January 28, 2015
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
H01B5/14; H01B13/00; H05K1/09; H05K3/10; H05K3/24
Domestic Patent References:
| WO2014030647A1 | 2014-02-27 | |||
| WO2011090034A1 | 2011-07-28 |
Foreign References:
| JP2010265420A | 2010-11-25 | |||
| JP2008258293A | 2008-10-23 | |||
| JPH01140870U | 1989-09-27 | |||
| JP2005152758A | 2005-06-16 | |||
| JP2009123408A | 2009-06-04 | |||
| JP2010003964A | 2010-01-07 |
Attorney, Agent or Firm:
MARUYAMA EIICHI (JP)
Maruyama Eiichi (JP)
Maruyama Eiichi (JP)
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