Title:
ELECTROCONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND ELECTROCONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2017/216947
Kind Code:
A1
Abstract:
An electroconductive pressure-sensitive adhesive composition which comprises an acrylic copolymer (A) and electroconductive particles (B) and has a durometer type 00 hardness, as provided for in ASTM D 2240, of 15 or greater at 85°C, and which, even when pulled by the repulsive force of the adherend in a high-temperature environment, is less apt to peel off, string, or decrease in electroconductivity; and an electroconductive pressure-sensitive adhesive tape which comprises an electroconductive substrate and, disposed on either or both of the surfaces thereof, a pressure-sensitive adhesive layer formed from the electroconductive pressure-sensitive adhesive composition.
Inventors:
YAMAGATA TOSHIHIRO (JP)
ISHIKAWA KAZUKI (JP)
ISHIKAWA KAZUKI (JP)
Application Number:
PCT/JP2016/068056
Publication Date:
December 21, 2017
Filing Date:
June 17, 2016
Export Citation:
Assignee:
TERAOKA SEISAKUSHO KK (JP)
International Classes:
C09J133/00; C09J7/02; C09J11/00; H01B1/00; H01B1/22; H05K9/00
Foreign References:
| JP2014136778A | 2014-07-28 | |||
| JP2015178595A | 2015-10-08 | |||
| JP2009091485A | 2009-04-30 |
Attorney, Agent or Firm:
ISHIBASHI, Masayuki et al. (JP)
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