Title:
ELECTROCONDUCTIVE SUBSTRATE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/196010
Kind Code:
A1
Abstract:
The present invention provides a production method for a three-dimensionally shaped electroconductive substrate comprising a decorative layer and a metal layer wherein line width uniformity is excellent. This electroconductive substrate production method comprises: a step 1 of forming a pattern-shaped plating target layer on one surface side of a substrate; a step 2 of forming a decorative layer on the other surface side of the substrate to obtain a decorative layer-equipped substrate; a step 3 of deforming the decorative layer-equipped substrate to obtain a decorative layer-equipped substrate having a three-dimensional shape; a step 4 of performing plating on the pattern-shaped plating target layer on the decorative layer-equipped substrate having the three-dimensional shape to form a metal layer; and a step 5 of forming a protective layer on the substrate in such a manner as to cover the metal layer. The method further comprises a step 6 of providing a plating catalyst or a precursor thereof to the pattern-shaped plating target layer between the step 3 and the step 4; alternatively, the plating target layer precursor layer contains the plating catalyst or the precursor thereof.
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Inventors:
NARITA TAKESHI (JP)
Application Number:
PCT/JP2020/011381
Publication Date:
October 01, 2020
Filing Date:
March 16, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B29C45/14; B29C45/26; B32B15/08; C23C18/16; C23C18/28; G06F3/041; H05K1/02; H05K3/18
Domestic Patent References:
| WO2018034291A1 | 2018-02-22 | |||
| WO2018012535A1 | 2018-01-18 | |||
| WO2016181824A1 | 2016-11-17 |
Foreign References:
| JP2010267607A | 2010-11-25 | |||
| JP2018154036A | 2018-10-04 | |||
| JP2011074407A | 2011-04-14 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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