Title:
ELECTRODE FOR METAL PLATING AND PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2003/060200
Kind Code:
A1
Abstract:
An electrode for metal plating which comprises a porous material being capable of conducting electricity at least on its surface and having been formed by heating and pressing a particulate material.
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Inventors:
KAWANA EISHIROU (JP)
HYODO KIYOSHI (JP)
YAMAGUCHI SEIJI (JP)
HYODO KIYOSHI (JP)
YAMAGUCHI SEIJI (JP)
Application Number:
PCT/JP2002/000282
Publication Date:
July 24, 2003
Filing Date:
January 17, 2002
Export Citation:
Assignee:
FUJITSU LTD (JP)
KAWANA EISHIROU (JP)
HYODO KIYOSHI (JP)
YAMAGUCHI SEIJI (JP)
KAWANA EISHIROU (JP)
HYODO KIYOSHI (JP)
YAMAGUCHI SEIJI (JP)
International Classes:
C25D17/10; C25D17/12; H05K3/42; (IPC1-7): C25D17/10
Foreign References:
| JPH0953200A | 1997-02-25 |
Attorney, Agent or Firm:
Itoh, Tadahiko (Yebisu Garden Place Tower 20-3, Ebisu 4-chom, Shibuya-ku Tokyo, JP)
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