Title:
ELECTRODE PLATE MANUFACTURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/118713
Kind Code:
A1
Abstract:
An electrode plate die-cutting apparatus comprises an master-plate support section (3) that can support a master plate for electrode plates on a support face (35) thereof; a drive unit that drives a cutter, which is arranged so as to have the blade thereof face the master-plate support section (3), in both the advancing and retreating directions; and a pressure adjustment unit (7) that sucks at the master plate on the support face (35), when the cutter is made to advance towards the master-plate support section (3) by the drive unit. The pressure adjustment unit (7) comprises, for example, piping (71), a first branching pipe (72), a first valve (75), and a decompression unit (74). Since the vicinity of the support face (35) is sucked at, the electrode plate is adsorbed and anchored to the support face (35) side, via penetration holes (94) formed on a sheet material (90).
Inventors:
UEDA Hisashi (16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
Application Number:
JP2011/057193
Publication Date:
September 29, 2011
Filing Date:
March 24, 2011
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD. (16-5, Konan 2-chome Minato-k, Tokyo 15, 〒1088215, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目１６番５号 Tokyo, 〒1088215, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目１６番５号 Tokyo, 〒1088215, JP)
International Classes:
H01M4/04; B26D7/01; B26F1/40; H01M4/139
Attorney, Agent or Firm:
MORI Ryuichirou et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
Claims: