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Patent Searching and Data


Title:
ELECTRODE PLATE MANUFACTURING DEVICE AND ELECTRODE PLATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/024358
Kind Code:
A1
Abstract:
An electrode plate manufacturing device 50 is for manufacturing a negative electrode plate 10 accommodated inside a bag-like separator 11. The electrode plate manufacturing device 50 cuts the downstream side of a belt-like sheet body 52 in a hanging state so that a portion of the downstream side of the belt-like sheet body 52 is dropped as a sheet body 30 constituting the separator 11. The electrode plate manufacturing device 50 receives the dropped sheet body 30 in an upright state, inserts the negative electrode plate 10 into the sheet body 30 from an X-direction, and folds the sheet body 30 such that the negative electrode plate 10 is sandwiched inside the sheet body 30. The electrode plate manufacturing device 50 is provided with a guide disposed on the outer side of the received sheet body 30 in a Y-direction in a movable manner in the Y-direction. When inserting the negative electrode plate 10 into the sheet body 30, the guide 81 regulates the position of the sheet body 30 in the Y-direction by moving to a position closer to the sheet body 30 than when the sheet body 30 is dropped.

Inventors:
UEDA HIROMASA (JP)
KITAMORI SHIGETAKA (JP)
HATAKENAKA TOSHIKAZU (JP)
TSUNODA DAISUKE (JP)
YAMADA YUKIMASA (JP)
Application Number:
PCT/JP2019/030747
Publication Date:
February 11, 2021
Filing Date:
August 05, 2019
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01M10/12; B26D1/04; B26D3/00; H01M4/16
Domestic Patent References:
WO2017131027A12017-08-03
Foreign References:
JPS5027039A1975-03-20
JPS5353740A1978-05-16
JPS60133654A1985-07-16
JPS5425433A1979-02-26
JP2000306596A2000-11-02
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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