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Title:
ELECTRODE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2006/016650
Kind Code:
A1
Abstract:
A PWB (150) comprising a plurality of electrodes formed on the surface of a substrate (153) wired with copper and consisting of glass epoxy, wherein both non-AU electrodes (151) not provided with Au surface layers of gold and Au electrodes (152) provided with Au surface layers are formed as electrodes. An oxidation inhibiting film (154) consisting of a flux, a material different from gold, is formed on the surfaces of the non-Au electrodes (151). The oxidation of the non-AU electrodes (151) is prevented by this oxidation inhibiting film (154) to enable the PWB (150) to be kept in stock.

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Inventors:
MORIYAMA EIJI (JP)
Application Number:
PCT/JP2005/014748
Publication Date:
February 16, 2006
Filing Date:
August 11, 2005
Export Citation:
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Assignee:
RICOH KK (JP)
RICOH MICROELECTRONICS CO LTD (JP)
MORIYAMA EIJI (JP)
International Classes:
H01L21/60; H05K3/34; H05K1/18
Foreign References:
JP2001283805A2001-10-12
JP2004171964A2004-06-17
JP2003318308A2003-11-07
JP2002008626A2002-01-11
JP2002368038A2002-12-20
JP2003204148A2003-07-18
JP2001308268A2001-11-02
JP2003282630A2003-10-03
US6494361B12002-12-17
Other References:
See also references of EP 1784065A4
Attorney, Agent or Firm:
Itoh, Tadahiko (Yebisu Garden Place Tower 20-3, Ebisu4-chome, Shibuya-k, Tokyo 32, JP)
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