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Title:
ELECTRODEPOSITED COPPER FOIL AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/002526
Kind Code:
A1
Abstract:
Disclosed is an electrodeposited copper foil which can exhibit various properties stably even when the chlorine content therein is varied. Specifically disclosed is an electrodeposited copper foil produced by electrolyzing a copper electrolytic solution, which is characterized in that the iodine content in the electrodeposited copper foil is 0.003 mass% or more, more preferably 0.003 mass% to 0.03 mass%. Preferably, the chlorine content in the electrodeposited copper foil is 0.0018 mass% or less.

Inventors:
TOMONAGA, Sakiko (LTD. Corporate R&D Center 1333-2, Haraichi, Ageo-sh, Saitama 21, 〒3620021, JP)
朝長 咲子 (〒21 埼玉県上尾市原市1333-2 三井金属鉱業株式会社 総合研究所内 Saitama, 〒3620021, JP)
INABA, Shintaro (LTD. Corporate R&D Center 1333-2, Haraichi, Ageo-sh, Saitama 21, 〒3620021, JP)
Application Number:
JP2011/065147
Publication Date:
January 05, 2012
Filing Date:
July 01, 2011
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO., LTD. (11-1, Osaki 1-chome Shinagawa-k, Tokyo 84, 〒1418584, JP)
三井金属鉱業株式会社 (〒84 東京都品川区大崎一丁目11番1号 Tokyo, 〒1418584, JP)
TOMONAGA, Sakiko (LTD. Corporate R&D Center 1333-2, Haraichi, Ageo-sh, Saitama 21, 〒3620021, JP)
朝長 咲子 (〒21 埼玉県上尾市原市1333-2 三井金属鉱業株式会社 総合研究所内 Saitama, 〒3620021, JP)
International Classes:
C25D1/04; C22C9/00; H01M4/66
Domestic Patent References:
2008-11-06
Foreign References:
JP2004035918A2004-02-05
JPS63186893A1988-08-02
JPS4978638A1974-07-29
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (Yoshimura International Patent Office, Omiya F Bldg. 5-4, Sakuragicho 2-chome, Omiya-ku, Saitama-sh, Saitama 54, 〒3300854, JP)
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Claims: