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Patent Searching and Data


Title:
ELECTROFORMING APPARATUS AND ELECTROFORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2003/018879
Kind Code:
A1
Abstract:
An electroforming apparatus and an electroforming method for performing a highly precise electroforming. An electrolyte (3) is continuously fed from a control bath (5) to an electroforming bath (1) housed in an outer bath (2), so that the electroforming is done in an overflow section (10) provided in the upper part of the electroforming bath (1). An electrocasting bus (25) held in a holding member (30) is conveyed along an overflow portion (10) by a member conveyor device (20). The electrolyte (3) having overflown from the electroforming bath (1) is recovered from the outer bath (2) into the control bath (5), filtered, and fed again to the electroforming bath (1).

Inventors:
ODA TOKUJI (JP)
ITIKAWA YUTAKA (JP)
Application Number:
PCT/JP2001/007176
Publication Date:
March 06, 2003
Filing Date:
August 22, 2001
Export Citation:
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Assignee:
OPTICAL FORMING CORP (JP)
ODA TOKUJI (JP)
ITIKAWA YUTAKA (JP)
International Classes:
B23Q3/10; B23Q11/00; B23Q11/08; C25D1/02; C25D21/18; F15B15/26; (IPC1-7): C25D1/02
Foreign References:
JPS4640082B11971-11-26
JPH0617290A1994-01-25
JPH04143298A1992-05-18
Other References:
See also references of EP 1424406A4
Attorney, Agent or Firm:
Shamoto, Ichio (Section 206 New Ohtemachi Bldg., 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo, JP)
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