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Patent Searching and Data


Title:
ELECTROFORMING MASTER AND METHOD FOR MANUFACTURING MOLD USING SAID MASTER
Document Type and Number:
WIPO Patent Application WO/2018/179948
Kind Code:
A1
Abstract:
Provided is an electroforming master in which a transfer failure is not liable to occur during an additional electroforming process after separation of an electroformed article. Also provided is a method for manufacturing a mold using the master. An electroforming master (1) is constituted by: a master body (10) having a concavo-convex pattern (12) formed on a surface thereof; and a jig (20) for preventing scratching during separation of an electroformed article, the jig (20) being fixed to the master body (10) and extending around the master body (10).

Inventors:
UMEZAWA TOMOKAZU (JP)
KAWASAKI NOBORU (JP)
Application Number:
PCT/JP2018/005106
Publication Date:
October 04, 2018
Filing Date:
February 14, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B29C33/38; C25D1/10; C25D1/22
Foreign References:
JPS61276988A1986-12-06
JP2012056246A2012-03-22
JPH07150386A1995-06-13
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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