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Patent Searching and Data


Title:
ELECTROFORMING SYSTEM AND ELECTROFORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2003/031693
Kind Code:
A1
Abstract:
An electroforming system and an electroforming method in which shaping of an electroforming body (especially, counter−boring in a hollow section) can be carried out easily and accurately. An air supply unit (11) is disposed in an electroforming bath (1) and an air bubble layer (12) is formed on the liquid level (3) of electroforming liquid (2). A tapered part (52) is formed at the upper end of a primary electroforming body (51) in the air bubble layer (12) by controlling up&sol down movement of a bus (50). A counter bore part (55) copying the tapered part (52) is formed in the hollow section (54) of a secondary electroforming body (53) by forming the secondary electroforming body (53) on the primary electroforming body (51) and the bus (50).

Inventors:
ODA TOKUJI (JP)
ITIKAWA YUTAKA (JP)
Application Number:
PCT/JP2001/008540
Publication Date:
April 17, 2003
Filing Date:
September 28, 2001
Export Citation:
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Assignee:
OPTICAL FORMING CORP (JP)
ODA TOKUJI (JP)
ITIKAWA YUTAKA (JP)
International Classes:
C25D1/02; C25D17/00; (IPC1-7): C25D1/02
Foreign References:
JPS353758B11960-04-16
JPS5217500B21977-05-16
JPH08239792A1996-09-17
JP2870301B21999-03-17
Other References:
See also references of EP 1433880A4
Attorney, Agent or Firm:
Shamoto, Ichio (Section 206 New Ohtemachi Bldg., 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo, JP)
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