Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTROFORMING SYSTEM AND ELECTROFORMING METHOD
Document Type and Number:
WIPO Patent Application WO2003031693
Kind Code:
A8
Abstract:
An electroforming system and an electroforming method in which shaping of an electroforming body especially, counter-boring in a hollow section can be carried out easily and accurately. An air supply unit 11 is disposed in an electroforming bath 1 and an air bubble layer 12 is formed on the liquid level 3 of electroforming liquid 2. A tapered part 52 is formed at the upper end of a primary electroforming body 51 in the air bubble layer 12 by controlling up/down movement of a bus 50. A counter bore part 55 copying the tapered part 52 is formed in the hollow section 54 of a secondary electroforming body 53 by forming the secondary electroforming body 53 on the primary electroforming body 51 and the bus 50.

Inventors:
ODA TOKUJI (JP)
ITIKAWA YUTAKA (JP)
Application Number:
PCT/JP2001/008540
Publication Date:
May 15, 2003
Filing Date:
September 28, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OPTICAL FORMING CORP (JP)
ODA TOKUJI (JP)
ITIKAWA YUTAKA (JP)
International Classes:
C25D1/02; C25D17/00; (IPC1-7): C25D1/02
Download PDF: