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Title:
ELECTROLESS NICKEL-PHOSPHORUS-COBALT PLATING BATH, AND ELECTROLESS NICKEL-PHOSPHORUS-COBALT PLATING FILM
Document Type and Number:
WIPO Patent Application WO/2019/087474
Kind Code:
A1
Abstract:
An electroless nickel-phosphorus-cobalt plating bath contains a water-soluble nickel salt, a hypophosphorous acid salt, a cobalt-containing compound and a heavy metal compound, and additionally contains at least one component selected from the group consisting of an acetylene compound, an iodide ion source or an iodic acid ion source, and a nitro-group-containing aromatic compound that contains at least one nitro group. The concentration of the acetylene compound is 10 to 120 mg/L, the concentration of the iodide ion source or the iodic acid ion source is 10 to 4000 mg/L, and the concentration of the nitro-group-containing aromatic compound is 0.1 to 5000 mg/L.

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JPS6210279ELECTROLESS PLATING BATH
JP2005240162THIN MAGNETIC FILM AND ITS MANUFACTURING METHOD, AND THIN-FILM MAGNETIC HEAD USING THE SAME
Inventors:
SATO MASAAKI (JP)
KUROSAKA SEIGO (JP)
Application Number:
PCT/JP2018/026954
Publication Date:
May 09, 2019
Filing Date:
July 18, 2018
Export Citation:
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Assignee:
UEMURA KOGYO KK (JP)
International Classes:
C23C18/50; H05K3/18
Foreign References:
JPH01205081A1989-08-17
JPH04187780A1992-07-06
JPS6324072A1988-02-01
JPS62502972A1987-11-26
JP2005126734A2005-05-19
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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