Title:
ELECTROLESS PLATINUM PLATING BATH
Document Type and Number:
WIPO Patent Application WO/2018/008242
Kind Code:
A1
Abstract:
This electroless platinum plating bath contains a water-soluble platinum compound, a complexing agent, a reducing agent and a halide ion donating agent; and the reducing agent is composed of formic acid.
Inventors:
SASAMURA TETSUYA (JP)
TANABE KATSUHISA (JP)
OKUBO HIROKI (JP)
SOMEYA TATSUSHI (JP)
FURUYA ERIKO (JP)
TANABE KATSUHISA (JP)
OKUBO HIROKI (JP)
SOMEYA TATSUSHI (JP)
FURUYA ERIKO (JP)
Application Number:
PCT/JP2017/016794
Publication Date:
January 11, 2018
Filing Date:
April 27, 2017
Export Citation:
Assignee:
UEMURA KOGYO KK (JP)
International Classes:
C23C18/44
Foreign References:
| JPS4856591A | 1973-08-08 | |||
| JPS591667A | 1984-01-07 | |||
| JP2016089190A | 2016-05-23 | |||
| JP2016089203A | 2016-05-23 |
Other References:
See also references of EP 3480339A4
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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