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Title:
ELECTROLESS SILVER PLATING SOLUTION FOR ELECTRONIC PARTS
Document Type and Number:
WIPO Patent Application WO/2000/031319
Kind Code:
A1
Abstract:
An electroless silver plating solution for electronic parts, characterized as comprising a silver salt, a complexing agent for silver, a fluorine-containing surfactant and a buffer salt for pH. The plating solution exhibits an effect of preventing migration phenomena and provides a plating bath having a long life. The silver salt is preferably silver nitrate, and the complexing agent for silver is preferably one or more of succinimide and phthalimide. The plating solution preferably contains 0.05 to 30 g/liter of silver ion, 0.1 to 200 g/liter of one or more of succinimide and phthalimide and 0.01 to 10 g/liter of a fluorine-containing surfactant. Further, the plating solution preferably contains an inorganic acid and/or an organic acid as the buffer salt for pH.

Inventors:
Serizawa, Seiichi (64-6, Higashi-omiya 6-chome Omiya-shi, Saitama, 330-0021, JP)
Ikawa, Masahiro (64-6, Higashi-omiya 6-chome Omiya-shi, Saitama, 330-0021, JP)
Takasaki, Ryuji (64-6, Higashi-omiya 6-chome Omiya-shi, Saitama, 330-0021, JP)
Application Number:
PCT/JP1999/006623
Publication Date:
June 02, 2000
Filing Date:
November 26, 1999
Export Citation:
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Assignee:
NIHON KOUJUNDO KAGAKU CO., LTD. (26-7, Minami-ikebukuro 2-chome Toshima-ku, Tokyo, 171-0022, JP)
Serizawa, Seiichi (64-6, Higashi-omiya 6-chome Omiya-shi, Saitama, 330-0021, JP)
Ikawa, Masahiro (64-6, Higashi-omiya 6-chome Omiya-shi, Saitama, 330-0021, JP)
Takasaki, Ryuji (64-6, Higashi-omiya 6-chome Omiya-shi, Saitama, 330-0021, JP)
International Classes:
C23C18/42; (IPC1-7): C23C18/42
Attorney, Agent or Firm:
Sato, Kazuo (Kyowa Patent & Law Office Fuji Building, Room 323 2-3, Marunouchi 3-chome Chiyoda-ku Tokyo, 100-0005, JP)
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