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Title:
ELECTROLYTE COPPER FOIL HAVING CARRIER FOIL, MANUFACTURING METHOD THEREOF, AND LAYERED PLATE USING THE ELECTROLYTE COPPER FOIL HAVING CARRIER FOIL
Document Type and Number:
WIPO Patent Application WO/2003/053680
Kind Code:
A1
Abstract:
It is possible to provide an electrolyte copper foil having carrier foil of peelable type in which the peeling strength between the carrier foil and the electrolyte copper layer is stabilized even when used in manufacturing a printed circuit board requiring a press treatment at 200 degrees C or above. An electrolyte copper foil (1) having carrier foil includes a junction boundary (4) provided on one side of the carrier foil (2) and an electrolyte copper foil layer (3) provided on the junction boundary (4). The electrolyte copper foil (1) having carrier foil is characterized in that the junction boundary (4) is made from a metal oxide (ML) and an organic agent layer (OL).

Inventors:
SUGIMOTO AKIKO (JP)
YOSHIOKA JUNSHI (JP)
DOBASHI MAKOTO (JP)
Application Number:
PCT/JP2002/013005
Publication Date:
July 03, 2003
Filing Date:
December 12, 2002
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
SUGIMOTO AKIKO (JP)
YOSHIOKA JUNSHI (JP)
DOBASHI MAKOTO (JP)
International Classes:
B32B9/00; B32B7/06; B32B15/08; B32B15/20; C25D1/04; H05K3/02; (IPC1-7): B32B15/04
Domestic Patent References:
WO2001021859A12001-03-29
Foreign References:
EP1133220A22001-09-12
EP0960725A21999-12-01
Attorney, Agent or Firm:
Tanaka, Daisuke (15-2 Hongo 1-chome Bunkyo-ku, Tokyo, JP)
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