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Patent Searching and Data


Title:
ELECTROLYTIC COPPER FOIL, CIRCUIT BOARD USING SAID, AND FLEXIBLE CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2013/002275
Kind Code:
A1
Abstract:
An electrolytic copper foil according to the present invention, having excellent pliability and flexibility, of which the crystal distribution per 300 μm2 before heat treatment (untreated) is 10,000-25,000 crystal grains having a grain diameter of less than 2 μm, and of which the crystal distribution per 300 μm2 after a one-hour heat treatment at 300°C is 5,000-15,000 crystal grains having a grain diameter of less than 2 μm. As regards this electrolytic copper foil, the percentage of change in the crystal orientation ratio (%) as measured by EBSD before heat treatment (untreated) to as measured by EBSD after a one-hour treatment at 300°C is within ±20% for each of the following: the sum of the (001) face and the (311) face; the sum of the (011) face and the (210) face; and the sum of the (331) face and the (210) face.

Inventors:
SAITO TAKAHIRO (JP)
Application Number:
PCT/JP2012/066416
Publication Date:
January 03, 2013
Filing Date:
June 27, 2012
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
SAITO TAKAHIRO (JP)
International Classes:
C25D1/04; H05K1/09
Foreign References:
JP2008013847A2008-01-24
Attorney, Agent or Firm:
SATOH, TAKAHISA (JP)
Takahisa Sato (JP)
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Claims: