Title:
ELECTROLYTIC COPPER FOIL AND COPPER-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2010/004988
Kind Code:
A1
Abstract:
In order to provide an electrolytic copper foil having flexibility/bending ability equivalent to or better than that of rolled copper foil, electrolytic copper foil is produced such that after thermal treatment is applied to the electrolytic copper foil so that the LMP value shown in formula 1 is 9000 or more, the crystal structure shows a red or blue color tone of 80% or more with respect to a plane with EBSP analysis. Formula 1:LMP＝(T+273)*(20+Logt) Here, 20 represents a material constant of copper, T represents temperature (°C), and t represents time (Hr). It is desirable that the relative strength of the (331) plane with respect to that of the (111) plane is 15 or greater after the thermal treatment is applied.
Inventors:
SUZUKI YUJI (JP)
SAITO TAKAHIRO (JP)
SAITO TAKAHIRO (JP)
Application Number:
PCT/JP2009/062362
Publication Date:
January 14, 2010
Filing Date:
July 07, 2009
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
SUZUKI YUJI (JP)
SAITO TAKAHIRO (JP)
SUZUKI YUJI (JP)
SAITO TAKAHIRO (JP)
International Classes:
C25D1/04
Domestic Patent References:
| WO2004059040A1 | 2004-07-15 |
Foreign References:
| JPS527819A | 1977-01-21 | |||
| JP2004035918A | 2004-02-05 | |||
| JP2007146289A | 2007-06-14 | |||
| JP2004250777A | 2004-09-09 | |||
| JP2006057177A | 2006-03-02 |
Other References:
See also references of EP 2312020A4
None
None
Attorney, Agent or Firm:
SATOH, TAKAHISA (JP)
Takahisa Sato (JP)
Takahisa Sato (JP)
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