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Title:
ELECTROLYTIC COPPER FOIL HAVING HIGH STRENGTH AND LESS PROJECTIONS DUE TO ABNORMAL ELECTRODEPOSITION AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/121020
Kind Code:
A1
Abstract:
Provided is an electrolytic copper foil, especially an electrolytic copper foil useful for a secondary battery negative electrode collector, having a high tensile strength in an ordinary state, a surface roughness (Rz) of 2.0 μm or less, and a small number of projections due to abnormal electrodeposition. The electrolytic copper foil is characterized in that the tensile strength in an ordinary state (referred to below as "ordinary-state tensile strength") is 45 kgf/mm2 to 70 kgf/mm2, the number of projections caused by abnormal electrodeposition and having a height of 1.0 µm or more and a diameter of 4.0 µm or more is 20/cm2 or less, and the surface roughness (Rz) is 2.0 μm or less.

Inventors:
KOHIKI MICHIYA (JP)
Application Number:
PCT/JP2012/054383
Publication Date:
September 13, 2012
Filing Date:
February 23, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
KOHIKI MICHIYA (JP)
International Classes:
C25D1/04; C25D1/00; H01M4/66
Foreign References:
JP2009293103A2009-12-17
JP2009004423A2009-01-08
JPH10330983A1998-12-15
JP2002294481A2002-10-09
JP2004107786A2004-04-08
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
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Claims: