Title:
ELECTROLYTIC COPPER FOIL HAVING A MODIFIED SHINY SIDE
Document Type and Number:
WIPO Patent Application WO1999045176
Kind Code:
A3
Abstract:
Treated electrolytic copper foil wherein the shiny side of the raw foil is modified and smoothed by an electrodeposited copper gilding layer, a copper-clad laminate produced with such foil, and an electrical circuit produced from such a laminate. The preferred foil has the surface of the shiny side of the raw foil modified by an electrodeposited copper gilding layer, a copper dendritic layer electrodeposited on the gilding layer, and a second copper gilding layer electrodeposited on the first dendritic layer, while a copper dendritic layer is electrodeposited on the surface of the matte side of the foil, and a copper gilding is electrodeposited on the latter dendritic layer.
Inventors:
YATES CHARLES B
WOLSKI ADAM
GASKILL GEORGE
CHENG CHINSAI T
BODENDORF KEITH
DUFRESNE PAUL
WOLSKI ADAM
GASKILL GEORGE
CHENG CHINSAI T
BODENDORF KEITH
DUFRESNE PAUL
Application Number:
PCT/US1999/004787
Publication Date:
October 28, 1999
Filing Date:
March 04, 1999
Export Citation:
Assignee:
CIRCUIT FOIL USA INC (US)
International Classes:
B32B15/08; C25D1/04; C25D5/10; C25D5/16; C25D7/06; H05K3/38; H05K3/06; (IPC1-7): C25D5/10; C25D5/16; H05K3/38
Foreign References:
| US5679230A | 1997-10-21 | |||
| US5447619A | 1995-09-05 |
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