Title:
ELECTROLYTIC COPPER FOIL AND METHOD FOR INSPECTING PHYSICAL PROPERTY THEREOF, AND COPPER CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2001/049903
Kind Code:
A1
Abstract:
An electrolytic copper foil having the low temperature annealing property that the crystal structure of the electrolytic copper foil undergoes recrystallization through the heat history during the manufacture of a copper clad laminate using the electrolytic copper foil and exhibiting a high elongation of 18 % or more in a hot atmosphere of 170°C, wherein the electrolytic copper foil has physical properties such that, in a process of the decrease of tensile strength with time during the aging treatment therefor in a hot atmosphere of 170°C, a maximum decreasing rate for its tensile strength appears in the range of 5 to 10 minutes of aging time, and, in a [tensile strength]-[heating time] curve having a knick part in a figure which plots aging time as the abscissa and tensile strength as the ordinate, a change of the tensile strength in the range of the knick part is 3 kg/mm?2¿ or more; and a method of inspection for the quality assurance of an electrolytic copper foil. The electrolytic copper foil can be used for solving the problems of occurrence of warpage or twisting and of dimensional stability with respect to a copper clad laminate having an electrolytic copper foil attached thereto.
Inventors:
TAKAHASHI NAOTOMI (JP)
HIRASAWA YUTAKA (JP)
HIRASAWA YUTAKA (JP)
Application Number:
PCT/JP2000/008947
Publication Date:
July 12, 2001
Filing Date:
December 18, 2000
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
TAKAHASHI NAOTOMI (JP)
HIRASAWA YUTAKA (JP)
TAKAHASHI NAOTOMI (JP)
HIRASAWA YUTAKA (JP)
International Classes:
B32B15/08; C22F1/00; C22F1/08; C25D1/04; G01N3/08; G01N3/32; G01N33/20; H05K1/09; G01N3/02; (IPC1-7): C25D1/04; H05K1/09; B32B15/08; C22F1/08; G01N3/00
Foreign References:
| JPH09241882A | 1997-09-16 | |||
| JPH07142831A | 1995-06-02 | |||
| JPS6210291A | 1987-01-19 | |||
| JP2000182623A | 2000-06-30 | |||
| JPH08283886A | 1996-10-29 | |||
| JPH1036991A | 1998-02-10 | |||
| JPH11262975A | 1999-09-28 |
Other References:
See also references of EP 1167581A4
Attorney, Agent or Firm:
Tanaka, Daisuke (Hongo 1-chome Bunkyo-ku, Tokyo, JP)
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