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Patent Searching and Data


Title:
ELECTROLYTIC COPPER FOIL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/150640
Kind Code:
A1
Abstract:
An electrolytic copper foil characterized in that the difference in Vickers hardness (Hv) between the front and back of the electrolytic copper foil or the treated electrolytic copper foil is 10 or less. The electrolytic copper foil, characterized in that the amount of curvature of the electrolytic copper foil or the treated electrolytic copper foil is 1 mm or less. A method for manufacturing an electrolytic copper foil, characterized in comprising heating an electrolytic copper foil or a treated electrolytic copper foil at 130-155°C in an oven to remove distortion of the electrolytic copper foil or the treated electrolytic copper foil. The present invention relates to an electrolytic copper foil in which curvature due to thermal load is reduced, and to a method for manufacturing the same, and particularly addresses the problem of providing an electrolytic copper foil useful in a negative electrode collector for a secondary cell.

Inventors:
MINAGAWA YOICHI (JP)
Application Number:
PCT/JP2012/059442
Publication Date:
October 10, 2013
Filing Date:
April 06, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
MINAGAWA YOICHI (JP)
International Classes:
C25D1/04; H01M4/66
Foreign References:
JPH07231152A1995-08-29
JPH08283886A1996-10-29
JP2007146289A2007-06-14
JP2001181886A2001-07-03
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
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