Title:
ELECTROLYTIC COPPER FOIL AND METHOD FOR PRODUCING ELECTROLYTIC COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2012/133565
Kind Code:
A1
Abstract:
The objective of the present invention is to provide: an electrolytic copper foil that has a high normal tensile strength, a low decrease in tensile strength after a thermal history, and a low concentration of impurities in the copper foil; and a method for producing the copper foil. Specifically, in the electrolytic copper foil, the concentration of sulfur is 10-50 ppm inclusive, lattices having 10 nm gaps are formed with respect to a STEM image obtained at a million times magnification by means of a scanning transmission electron microscope, and when measuring the sulfur concentration with the intersections of the lattices as the measurement points, there are measurement points at which the concentration of sulfur is higher compared to the concentration of sulfur in the copper foil.
Inventors:
KOHIKI MICHIYA (JP)
Application Number:
PCT/JP2012/058202
Publication Date:
October 04, 2012
Filing Date:
March 28, 2012
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
KOHIKI MICHIYA (JP)
KOHIKI MICHIYA (JP)
International Classes:
C25D1/04
Foreign References:
| JPH1036992A | 1998-02-10 | |||
| JP2002053993A | 2002-02-19 | |||
| JP3850155B2 | 2006-11-29 | |||
| JP2008101267A | 2008-05-01 | |||
| JP2009299100A | 2009-12-24 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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