ELECTROLYTIC COPPER FOIL AND PROCESS FOR PRODUCING ELECTROLYTIC COPPER FOIL, SURFACE TREATED ELCTROLYTIC COPPER FOIL USING SAID ELECTROLYTIC COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD USING SAID SURFACE TREATED ELECTROLYTIC COPPER FOIL

Title:

Document Type and Number:

WIPO Patent Application WO/2006/106956

Kind Code:

A1

Abstract:

This invention provides an electrolytic copper foil, which, as compared with low-profile electrolytic copper foils which have been supplied into the market, has lower profile and is glossy. The electrolytic copper foil has an ultralow profile of less than 1.0 μm in terms of surface roughness (Rzjis) on the deposition face side independently of the thickness of the electrolytic copper foil, and, at the same time, the gloss [Gs(60º)] of the deposition face is not less than 400. This electrolytic copper foil can be produced, for example, by electrolysis using a sulfuric acid-type copper electrolysis solution prepared by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.

Inventors:

MATSUDA MITSUYOSHI (JP)
SAKAI HISAO (JP)
TOMONAGA SAKIKO (JP)
DOBASHI MAKOTO (JP)

Application Number:

PCT/JP2006/306920

Publication Date:

October 12, 2006

Filing Date:

March 31, 2006

Export Citation:

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Assignee:

MITSUI MINING & SMELTING CO (JP)
MATSUDA MITSUYOSHI (JP)
SAKAI HISAO (JP)
TOMONAGA SAKIKO (JP)
DOBASHI MAKOTO (JP)

International Classes:

C25D1/00; C25D1/04; H05K1/09

Foreign References:

JP2004162172A	2004-06-10
JP2001329390A	2001-11-27
JP2004035918A	2004-02-05
JP2005159239A	2005-06-16
JP2005029818A	2005-02-03
JP2004263289A	2004-09-24
JPH09143785A	1997-06-03
JP2004035918A	2004-02-05

Other References: