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Patent Searching and Data


Title:
ELECTROLYTIC COPPER FOIL AND PROCESS FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/033917
Kind Code:
A1
Abstract:
Provided is an electrolytic copper foil which has high normal-state tensile strength, is reduced in surface roughness, and has few protrusions due to abnormal electrodeposition, in particular, an electrolytic copper foil which is useful as a negative current collector for secondary batteries. This electrolytic copper foil is a copper foil which has a normal-state tensile strength of 45-70 kgf/mm2, and in which the number of protrusions due to abnormal electrodeposition that have a height of 1.0 µm or more and a diameter of 4.0 µm or more is 20 or less per cm2, and which has a surface roughness Rz of 2.0 µm or less.

Inventors:
KOHIKI MICHIYA (JP)
Application Number:
PCT/JP2012/072183
Publication Date:
March 06, 2014
Filing Date:
August 31, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
KOHIKI MICHIYA (JP)
International Classes:
C25D1/04
Domestic Patent References:
WO2009116432A12009-09-24
Foreign References:
JP2004263289A2004-09-24
JP2007217791A2007-08-30
JP2009293103A2009-12-17
JP2004107786A2004-04-08
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
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