Title:
ELECTROLYTIC COPPER FOIL, SURFACE TREATED COPPER FOIL USING THE ELECTROLYTIC COPPER FOIL, COPPER-CLAD LAMINATED PLATE USING THE SURFACE TREATED COPPER FOIL, AND METHOD FOR MANUFACTURING THE ELECTROLYTIC COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2007/125994
Kind Code:
A1
Abstract:
This invention provides an electrolytic copper foil, which has a low profile surface equivalent to conventional low-profile electrolytic copper foil and has very large mechanical strength, and a method for manufacturing the same. In the electrolytic copper foil, the precipitated crystal particles of copper are fine, and the particle diameter has a small variation unattainable by the prior art technique. More specifically, the electrolytic copper foil has a low-profile and glossy surface, has a very large mechanical strength of 70 kgf/mm2 to 100 kgf/mm2 in terms of normal-state tensile strength value and, even after heating (180°C x 60 min), has a tensile strength value of not less than 85% of normal-state tensile strength value. The electrolytic copper foil is manufactured by an electrolytic method using a sulfuric acid-type copper electrolysis solution containing a compound having a structure comprising a sulfone group attached to the benzene ring, a sulfonic acid salt of an active sulfur compound, and a quaternary ammonium salt polymer having a cyclic structure. As shown in the drawing, this elctrolytic copper foil is suitable for the manufacture of TAB having a flying lead.
More Like This:
Inventors:
SAKAI HISAO (JP)
TAKAHASHI MASARU (JP)
MATSUDA MITSUYOSHI (JP)
DOBASHI MAKOTO (JP)
TAKAHASHI MASARU (JP)
MATSUDA MITSUYOSHI (JP)
DOBASHI MAKOTO (JP)
Application Number:
PCT/JP2007/059056
Publication Date:
November 08, 2007
Filing Date:
April 26, 2007
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
SAKAI HISAO (JP)
TAKAHASHI MASARU (JP)
MATSUDA MITSUYOSHI (JP)
DOBASHI MAKOTO (JP)
SAKAI HISAO (JP)
TAKAHASHI MASARU (JP)
MATSUDA MITSUYOSHI (JP)
DOBASHI MAKOTO (JP)
International Classes:
C25D1/04; H05K1/09
Domestic Patent References:
| WO1997043466A1 | 1997-11-20 | |||
| WO2004055246A1 | 2004-07-01 |
Foreign References:
| JP2001329390A | 2001-11-27 | |||
| JPH10330983A | 1998-12-15 | |||
| JP2004339558A | 2004-12-02 | |||
| JPH07188969A | 1995-07-25 | |||
| JPH11501268A | 1999-02-02 | |||
| JP2006152420A | 2006-06-15 | |||
| JP2001123289A | 2001-05-08 |
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (Omiya F Bldg. 5-4, Sakuragicho 2-chome, Omiya-ku, Saitama-sh, Saitama 54, JP)
Download PDF:
Previous Patent: PHOTOSENSITIVE RESIN LAMINATE
Next Patent: WATER QUALITY IMPROVING UNIT AND WATER QUALITY IMPROVING DEVICE
Next Patent: WATER QUALITY IMPROVING UNIT AND WATER QUALITY IMPROVING DEVICE