Title:
ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2001/034880
Kind Code:
A1
Abstract:
An electrolytic copper foil with a carrier foil having a carrier foil, a bonding interface layer formed thereon, and an electrolytic copper foil formed on the interface layer, characterized in that the carrier foil is a copper foil and the bonding interface layer comprises a mixture of an organic material and metal particles; and a method for manufacturing the electrolytic copper foil with a carrier foil. The electrolytic copper foil with a carrier foil having a carrier foil allows the control of the minimum value of a peeling adhesion strength between the carrier foil and the electrolytic copper foil.
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Inventors:
YOSHIOKA JUNSHI (JP)
SUGIMOTO AKIKO (JP)
DOBASHI MAKOTO (JP)
IWAKIRI KENICHIRO (JP)
HIRASAWA YUTAKA (JP)
SUGIMOTO AKIKO (JP)
DOBASHI MAKOTO (JP)
IWAKIRI KENICHIRO (JP)
HIRASAWA YUTAKA (JP)
Application Number:
PCT/JP2000/006764
Publication Date:
May 17, 2001
Filing Date:
September 29, 2000
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
YOSHIOKA JUNSHI (JP)
SUGIMOTO AKIKO (JP)
DOBASHI MAKOTO (JP)
IWAKIRI KENICHIRO (JP)
HIRASAWA YUTAKA (JP)
YOSHIOKA JUNSHI (JP)
SUGIMOTO AKIKO (JP)
DOBASHI MAKOTO (JP)
IWAKIRI KENICHIRO (JP)
HIRASAWA YUTAKA (JP)
International Classes:
C25C1/12; C25D1/04; C25D1/22; C25D7/06; C25D9/02; H05K1/09; H05K3/02; H05K3/38; (IPC1-7): C25D1/22; H05K1/09
Foreign References:
JPS63274795A | 1988-11-11 | |||
JPH02113591A | 1990-04-25 | |||
JPH05102630A | 1993-04-23 |
Attorney, Agent or Firm:
Tanaka, Daisuke (Hongo 1-chome Bunkyo-ku, Tokyo, JP)
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