Title:
ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL
Document Type and Number:
WIPO Patent Application WO/2004/005588
Kind Code:
A1
Abstract:
An electrolytic copper foil with carrier foil that enables easily performing a multilayering process and enables forming circuits of finer pitch as demanded in contemporary printed wiring boards. In particular, an electrolytic copper foil with carrier foil, obtained by forming a joint interface layer on a surface of carrier foil and forming an electrolytic copper foil layer on the joint interface layer, wherein the electrolytic copper foil layer is provided with a rust-proofing layer without the application of nodulation roughening and wherein a nickel/zinc alloy comprising 50 to 99 wt.% of nickel and 50 to 1 wt.% of zinc is employed in the rust-proofing layer.
Inventors:
NAGATANI SEIJI (JP)
Application Number:
PCT/JP2003/008193
Publication Date:
January 15, 2004
Filing Date:
June 27, 2003
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
NAGATANI SEIJI (JP)
NAGATANI SEIJI (JP)
International Classes:
C25D1/04; H05K3/02; H05K3/38; (IPC1-7): C25D1/20; C25D7/06; H05K1/09; H05K3/38; B32B15/08
Domestic Patent References:
WO2001016402A1 | 2001-03-08 | |||
WO2001021859A1 | 2001-03-29 |
Foreign References:
EP0960725A2 | 1999-12-01 | |||
JPH0529740A | 1993-02-05 |
Attorney, Agent or Firm:
Tanaka, Daisuke (15-2 Hongo 1-chom, Bunkyo-ku Tokyo, JP)
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