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Patent Searching and Data


Title:
ELECTROLYTIC COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2012/066991
Kind Code:
A1
Abstract:
An electrolytic copper foil which has a surface roughness Rz of 2.0 µm or less, characterized by having a width-direction difference in thickness of 1.5% or less. Also disclosed are the electrolytic copper foil characterized by having a width-direction difference in thickness of 1.3% or less and the electrolytic copper foil characterized by having a value of width-direction unevenness in roughness, (Rzmax-Rzmin)/Rzavg, of 15% or less. The invention addresses the problem of obtaining an electrolytic copper foil which has a low surface roughness and has an even thickness in the width direction and the lengthwise direction and which hence is inhibited from having "elongation wrinkles" or having discolored streaks that extend along the lengthwise direction.

Inventors:
KOHIKI MICHIYA (JP)
Application Number:
PCT/JP2011/075794
Publication Date:
May 24, 2012
Filing Date:
November 09, 2011
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
KOHIKI MICHIYA (JP)
International Classes:
H05K1/09; C25D1/04
Domestic Patent References:
WO2005010239A12005-02-03
WO2004055246A12004-07-01
WO2004059040A12004-07-15
Foreign References:
JPH0436489A1992-02-06
JPH0436491A1992-02-06
JPH0436494A1992-02-06
JP2002004095A2002-01-09
JPH1018076A1998-01-20
JP2001020090A2001-01-23
JP2004190112A2004-07-08
JP2506573B21996-06-12
JP2506574B21996-06-12
JP2506575B21996-06-12
JP2594840B21997-03-26
JP3416620B22003-06-16
JP2004107786A2004-04-08
Attorney, Agent or Firm:
OGOSHI, Isamu (JP)
Isamu Ogoshi (JP)
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Claims: