Title:
ELECTROLYTIC COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2021/153256
Kind Code:
A1
Abstract:
Provided is electrolytic copper foil that has a high degree of smoothness and yet exhibits high flexibility which is suitable for a flexible substrate (in particular, high flexibility obtained after being annealed for 1 hour at 180°C). This electrolytic copper foil has a ten-point mean roughness Rz of 0.1-2.0 μm on at least one surface thereof, and is configured such that when subjected to a cross sectional analysis by electron backscatter diffraction (EBSD), among the area of the observation field occupied by copper crystal grains, the proportion of area occupied by copper crystal grains satisfying all of the following is at least 63%: i) oriented toward the (101)-plane; ii) the aspect ratio is 0.500 or less; iii) when the angle formed by a line normal to the electrode surface of the electrolytic copper foil and the major axes of the copper crystal grains is θ (°), ׀sinθ׀ is 0.001-0.707; and iv) when the crystal is elliptically approximated, the minor axis length is 0.38 μm or less.
Inventors:
NAKAJIMA DAISUKE (JP)
MATSUDA MITSUYOSHI (JP)
HARA YASUJI (JP)
WADA MITSUHIRO (JP)
MATSUDA MITSUYOSHI (JP)
HARA YASUJI (JP)
WADA MITSUHIRO (JP)
Application Number:
PCT/JP2021/001102
Publication Date:
August 05, 2021
Filing Date:
January 14, 2021
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D1/04; C25D1/00
Domestic Patent References:
| WO2014104233A1 | 2014-07-03 | |||
| WO2014119355A1 | 2014-08-07 |
Foreign References:
| JP2016160503A | 2016-09-05 | |||
| JP2016537514A | 2016-12-01 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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