Title:
ELECTROLYTIC COPPER PLATE OR COPPER ALLOY PLATING BATH
Document Type and Number:
WIPO Patent Application WO/2020/158418
Kind Code:
A1
Abstract:
An electrolytic copper plate or a copper alloy plating bath, each of which contains at least two types of electrolytes, wherein at least one of nitric acid and a nitrate salt is included in the electrolytes. By using the electrolytic copper plate or the copper alloy plating bath, it becomes possible to form electrodeposits, e.g., a bump electrode group, each having a high aspect at a high speed and in a uniform height or thickness.
Inventors:
HATABE MASARU (JP)
MURAKAMI HIRONORI (JP)
YAMAOKA FUKA (JP)
MURAKAMI HIRONORI (JP)
YAMAOKA FUKA (JP)
Application Number:
PCT/JP2020/001294
Publication Date:
August 06, 2020
Filing Date:
January 16, 2020
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD (JP)
International Classes:
C25D3/38; C25D3/58; C25D7/00; C25D7/12; H01L21/60
Foreign References:
| JP2013229596A | 2013-11-07 | |||
| JPH09202990A | 1997-08-05 | |||
| JP2003533867A | 2003-11-11 | |||
| JP2017036502A | 2017-02-16 |
Other References:
"Throwing power of copper plating sulfate electrolyte containing nitrate ion", ZASHCHITA METALLOV, vol. 24, no. 2, 1988, pages 305 - 307, ISSN: 0044-1856
Attorney, Agent or Firm:
ISEKI Katsumori et al. (JP)
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