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Patent Searching and Data


Title:
ELECTROLYTIC COPPER PLATING BATH
Document Type and Number:
WIPO Patent Application WO/2020/044432
Kind Code:
A1
Abstract:
The present invention provides an electrolytic copper plating bath which has excellent via hole filling properties. An electrolytic copper plating bath according to the present invention contains a reaction product of a compound that contains an amino group in each molecule and a compound that contains an epoxy group in each molecule, said reaction product being obtained in the presence of an acid. The compound that contains an amino group in each molecule contains an amine compound that is represented by a specific general formula. The compound that contains an epoxy group in each molecule contains an epoxide compound that is represented by a specific general formula.

Inventors:
IKEDA KEN
KISHIMOTO KAZUKI
TAKAYA YASUKO
YASUDA HIROKI
SHIMOMURA AYA
HARASAKI YUSUKE
SAWA MASAHIRO
KIYOHARA YASUSHI
FUJIWARA IORI
TANAKA MASAO
ABE MINEO
Application Number:
JP2018/031730
Publication Date:
March 05, 2020
Filing Date:
August 28, 2018
Export Citation:
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Assignee:
JCU CORP (JP)
GOO CHEMICAL CO LTD (JP)
International Classes:
C25D3/38; C25D7/00; H05K3/18; H05K3/42
Foreign References:
JP2012149351A2012-08-09
JP2012172195A2012-09-10
US20180237932A12018-08-23
JP2016148023A2016-08-18
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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