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Title:
ELECTROLYTIC COPPER PLATING SOLUTION, METHOD FOR PRODUCING SAME, AND ELECTROLYTIC COPPER PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/111919
Kind Code:
A1
Abstract:
The present invention provides: an electrolytic copper plating solution which contains (A) sulfate ions, (B) a compound represented by general formula (1) and (C) copper ions, wherein the content of the component (B) is from 0.3 to 50 parts by mass and the content of the component (C) is from 5 to 50 parts by mass, both relative to 100 parts by mass of the content of the component (A); a method for producing this electrolytic copper plating solution; and an electrolytic copper plating method which uses this electrolytic copper plating solution. (In the formula, each of R1 and R2 independently represents a hydrogen atom, a sodium atom, a potassium atom or an alkyl group having from 1 to 5 carbon atoms; and n represents 1 or 2.)

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Inventors:
TAKAHASHI TAKUYA (JP)
ISHIWATA SHINYA (JP)
HATSUKADE TOMOKO (JP)
Application Number:
PCT/JP2020/043577
Publication Date:
June 10, 2021
Filing Date:
November 24, 2020
Export Citation:
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Assignee:
ADEKA CORP (JP)
International Classes:
C25D3/38; C25D7/12
Foreign References:
JPH07316875A1995-12-05
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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