Title:
ELECTROLYTIC HARD GOLD PLATING SOLUTION AND PLATING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/070933
Kind Code:
A1
Abstract:
Disclosed is a plating solution which does not result in pinholes in a metal film even if the metal film is less than 0.1μm thick. Partial plating is performed using an electrolytic hard gold plating solution containing gold cyanide and/or gold cyanide salt, water-soluble cobalt salt or water-soluble nickel salt, conducting salts of organic acids, an aromatic sulfonic acid compound, a combination of one or more items selected from a group consisting of carboxylic acids, oxycarboxylic acids, and the salts thereof, and a nitrogen-containing five-membered heterocyclic compound. Consequently, pinholes are not caused in a metal film even if the metal film is less than 0.1μm thick.
Inventors:
FURUKAWA MASATO (JP)
SON INJOON (JP)
SON INJOON (JP)
Application Number:
PCT/JP2010/071304
Publication Date:
June 16, 2011
Filing Date:
November 30, 2010
Export Citation:
Assignee:
N E CHEMCAT CORP (JP)
FURUKAWA MASATO (JP)
SON INJOON (JP)
FURUKAWA MASATO (JP)
SON INJOON (JP)
International Classes:
C25D3/62
Foreign References:
| JP2003502513A | 2003-01-21 | |||
| JP2009007656A | 2009-01-15 | |||
| JPS637390A | 1988-01-13 | |||
| JPS5075531A | 1975-06-20 | |||
| JP3933930B2 | 2007-06-20 | |||
| JP2009165730A | 2009-07-30 |
Other References:
See also references of EP 2511400A4
Attorney, Agent or Firm:
TAKAHATA Yasuyo et al. (JP)
Yasuyo Takahata (JP)
Yasuyo Takahata (JP)
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