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Patent Searching and Data


Title:
ELECTROMAGNETIC INDUCTION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2015/068265
Kind Code:
A1
Abstract:
In this electromagnetic induction apparatus, a coil body is configured by electrically connecting and superposing coil sections comprising a wiring pattern of a printed wiring board and a metal member of which both ends are connected to the wiring pattern, and so for example by attaching a cooling means to the printed wiring board, it is possible to efficiently radiate heat from the coil body and to reduce thermal resistance.

Inventors:
URYU YUTA (JP)
DEGUCHI YOSHIYUKI (JP)
Application Number:
PCT/JP2013/080261
Publication Date:
May 14, 2015
Filing Date:
November 08, 2013
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01F37/00; H01F27/30
Foreign References:
JP2005223129A2005-08-18
JP2002367830A2002-12-20
JPS5016485B11975-06-13
JPH06290972A1994-10-18
JP2010183751A2010-08-19
JP2009094328A2009-04-30
Other References:
See also references of EP 3067903A4
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
Michiharu Soga (JP)
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