Title:
ELECTROMAGNETIC INTERFERENCE SHIELDING FILM, CIRCUIT BOARD, AND PREPARATION METHOD FOR ELECTROMAGNETIC INTERFERENCE SHIELDING FILM
Document Type and Number:
WIPO Patent Application WO/2019/174062
Kind Code:
A1
Abstract:
An electromagnetic interference shielding film, a circuit board comprising the electromagnetic interference shielding film, and a preparation method for the electromagnetic interference shielding film. The electromagnetic interference shielding film comprises a shielding layer (1) and an adhesive film layer (2); the shielding layer (1) comprises a first surface (11) and a second surface (12) opposite to each other; the second surface (12) is a wavy uneven surface; convex conductor particles (121) are also formed on the wavy uneven surface; the second surface (12) of the shielding layer (1) is provided with the adhesive film layer (2), and the adhesive film layer (2) of the electromagnetic interference shielding film extrudes adhesive substances into concave parts (123) of the second surface (12) in the pressing process, the adhesive volume is increased, and the delamination phenomenon is avoided; moreover, the wavy uneven surface is also provided with the conductor particles (121) in a certain height, so that the shielding layer (1) can be ensured to pierce the adhesive film layer (2) successfully in the pressing process to realize reliable grounding; the practicability is high.
Inventors:
SU ZHI (CN)
Application Number:
PCT/CN2018/079966
Publication Date:
September 19, 2019
Filing Date:
March 22, 2018
Export Citation:
Assignee:
GUANGZHOU FANG BANG ELECTRONICS CO LTD (CN)
International Classes:
H05K9/00
Foreign References:
| CN208095043U | 2018-11-13 | |||
| CN206650912U | 2017-11-17 | |||
| CN104332217A | 2015-02-04 | |||
| CN107079611A | 2017-08-18 | |||
| CN105101761A | 2015-11-25 | |||
| JP2005311039A | 2005-11-04 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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