Title:
ELECTROMAGNETIC INTERFERENCE SHIELDING FILM
Document Type and Number:
WIPO Patent Application WO/2019/033723
Kind Code:
A1
Abstract:
An electromagnetic interference (EMI) shielding film, comprising an EMI shield layer (200) and an insulating layer (100) covering the EMI shield layer (200); the EMI shield layer (200) comprises a composite metal layer (201) and a first conductive bonding layer (202); the upper surface of the composite metal layer (201) is bonded to the insulating layer (100); the lower surface of the composite metal layer (201) is bonded to the first conductive bonding layer. The EMI shielding film solves the problem in the prior art of poor conductive shielding.
Inventors:
YAN YONG (CN)
GAO XIAOJUN (CN)
GAO XIAOJUN (CN)
Application Number:
PCT/CN2018/075983
Publication Date:
February 21, 2019
Filing Date:
February 09, 2018
Export Citation:
Assignee:
SUZHOU CHENGBANGDALI MATERIAL TECH CO LTD (CN)
International Classes:
H05K9/00
Foreign References:
| CN102510712A | 2012-06-20 | |||
| CN102300399A | 2011-12-28 | |||
| CN104853576A | 2015-08-19 | |||
| CN107333461A | 2017-11-07 | |||
| CN104883865A | 2015-09-02 | |||
| CN104853577A | 2015-08-19 | |||
| JPH11266095A | 1999-09-28 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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