Title:
ELECTROMAGNETIC WAVE ABSORBENT BODY, SYSTEM COMPRISING ELECTROMAGNETIC WAVE ABSORBENT BODY, AND ELECTROMAGNETIC WAVE ABSORPTION METHOD USING ELECTROMAGNETIC WAVE ABSORBENT BODY
Document Type and Number:
WIPO Patent Application WO/2022/181772
Kind Code:
A1
Abstract:
Provided are an electromagnetic wave absorbent body using a magnetic loss based on Mie resonance of a dielectric, a system comprising said electromagnetic wave absorbent body, and an electromagnetic wave absorption method using said electromagnetic wave absorbent body. This electromagnetic wave absorbent body comprises a substrate, and a dielectric arrangement group configured of a plurality of disc-shaped dielectrics. Each dielectric forming the dielectric arrangement group has a front surface and a bottom surface, and is disposed so that the bottom surface is opposite to one surface of the substrate. This electromagnetic wave absorbent body comprises a substrate, and a dielectric arrangement group configured of a plurality of disc-shaped dielectrics. Each dielectric forming the dielectric arrangement group has a front surface and a bottom surface, and is disposed so that the bottom surface is opposite to one surface of the substrate. For the dielectrics forming the dielectric arrangement group, the real part εr' of the relative permittivity is 30 or more at 100 MHz, the average diameter Dm is 100 μm to 10000 μm (0.1 mm to 10 mm), the average thickness Tm is 20 μm to 300 μm (0.02 mm to 0.3 mm), a ratio (Dm/Tm ratio) of the average diameter Dm over the average thickness Tm is 3 or more, and the coefficient of variation CV of the thickness T is 20% or smaller.
Inventors:
HYODO KAZUSHIGE (JP)
Application Number:
PCT/JP2022/007933
Publication Date:
September 01, 2022
Filing Date:
February 25, 2022
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
E04B1/92; H01Q17/00; H05K9/00
Foreign References:
| JP2011014723A | 2011-01-20 | |||
| JP2004153135A | 2004-05-27 | |||
| JP2013201359A | 2013-10-03 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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