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Title:
ELECTROMAGNETIC WAVE ABSORBER AND MOLDED ARTICLE WITH ELECTROMAGNETIC WAVE ABSORBER
Document Type and Number:
WIPO Patent Application WO/2018/159058
Kind Code:
A1
Abstract:
This electromagnetic wave absorber (1a) is provided with: a first layer (10a) that is a dielectric layer or a magnetic layer; and a conductive layer (20a) that is provided on at least one surface of the first layer (10a). The conductive layer (20a) has a sheet resistance of 100 Ω/□ or less after having this electromagnetic wave absorber (1a) exposed to an environment at a temperature of 85°C and at a relative humidity of 85% for 1,000 hours. This electromagnetic wave absorber (1a) also has a bending stiffness of 7,000 MPa∙mm4 or less.

Inventors:
MACHINAGA HIRONOBU (JP)
UKEI HIROICHI (JP)
UI TAKEHIRO (JP)
YAMAGATA KAZUTO (JP)
TAKEDA YUUKI (JP)
Application Number:
PCT/JP2017/044443
Publication Date:
September 07, 2018
Filing Date:
December 11, 2017
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K9/00; B32B7/02
Domestic Patent References:
WO2014098065A12014-06-26
Foreign References:
JP2009239211A2009-10-15
JP2005203438A2005-07-28
JP2003198179A2003-07-11
JP2012094764A2012-05-17
Other References:
See also references of EP 3573439A4
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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