Title:
ELECTROMAGNETIC WAVE SHIELD FILM
Document Type and Number:
WIPO Patent Application WO/2023/090334
Kind Code:
A1
Abstract:
The present invention provides an electromagnetic wave shield film that is not easily damaged even when placed on a high step-height substrate. The electromagnetic wave shield film comprises a protective layer and an isotropic conductive adhesive layer laminated on the protective layer, wherein the protective layer contains a protective layer filler, the isotropic conductive adhesive layer contains a resin component, a conductive filler, and a non-conductive filler, the ratio of the weight of the conductive filler to the weight of the non-conductive filler (the weight of the conductive filler/the weight of the non-conductive filler) is 15.0-23.0, and the ratio of the total weight of the conductive filler and the non-conductive filler to the weight of the protective layer filler ((the weight of the conductive filler + the weight of the non-conductive filler)/the weight of the protective layer filler) is 1.9-2.2.
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Inventors:
AOYAGI YOSHIHIKO (JP)
KAMINO KENJI (JP)
KAMINO KENJI (JP)
Application Number:
PCT/JP2022/042463
Publication Date:
May 25, 2023
Filing Date:
November 16, 2022
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B7/025
Domestic Patent References:
| WO2020009229A1 | 2020-01-09 |
Foreign References:
| JP2020007484A | 2020-01-16 | |||
| JP2019046871A | 2019-03-22 | |||
| JP2015206992A | 2015-11-19 | |||
| JP2019163419A | 2019-09-26 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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